| 发明名称 |
Method of bending outer leads of a semiconductor device. |
| 摘要 |
<p>A method of bending outer leads of a semiconductor device, wherein the outer leads arranged substantially horizontally are preparatorily bent upward or downward from their roots, and thereafter bent into a predetermined configuration, thereby to obtain final outer leads (2A', 2B'). <IMAGE></p> |
| 申请公布号 |
EP0454053(A2) |
申请公布日期 |
1991.10.30 |
| 申请号 |
EP19910106510 |
申请日期 |
1991.04.23 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
FURUDATE, NOBUHIRO, C/O INTELLECTUAL PROPERTY DIV.;TOGASHI, MINORU, C/O INTELLECTUAL PROPERTY DIV. |
| 分类号 |
H05K13/04;H01L21/48;H01L23/50 |
主分类号 |
H05K13/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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