发明名称 Independent cooling chamber for multichip unit.
摘要 <p>An independent cooling chamber for multichip units includes a housing defining a first chamber. The housing is secured to a multichip unit over at least one semiconductor chip that is a part of the multichip unit. An interface between the housing and the multichip unit includes a seal providing a fluid tight seal between the sides of the housing and the multichip unit, thus defining a first fluid tight chamber within which one or more semiconductor chips are located. A first coolant is provided in the first fluid tight chamber. The first coolant is in heat transfer relationship with the semiconductor chips located in the first fluid tight chamber. The housing includes a heat exchanger including a second chamber in heat transfer relationship with the first chamber. A second coolant is contained within the second chamber for transfer of heat from the first coolant. <IMAGE></p>
申请公布号 EP0453675(A1) 申请公布日期 1991.10.30
申请号 EP19900304593 申请日期 1990.04.27
申请人 DIGITAL EQUIPMENT CORPORATION 发明人 GRIFFITH, JAMES L.
分类号 H01L23/427;H01L23/467;H05K7/20 主分类号 H01L23/427
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