发明名称 |
Interconnection structure and test method |
摘要 |
Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures. |
申请公布号 |
US5060844(A) |
申请公布日期 |
1991.10.29 |
申请号 |
US19900555120 |
申请日期 |
1990.07.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BEHUN, JOHN R.;CALL, ANSON J.;CAPPO, FRANCIS F.;COLE, MARIE S.;HOEBENER, KARL G.;KLINGEL, BRUNO T.;MILLIKEN, JOHN C. |
分类号 |
H01L21/66;G01R31/04;G01R31/28;H01L21/56;H01L21/98;H05K1/18;H05K3/34 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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