| 摘要 |
PURPOSE:To contrive to improve workability by conducting a work such as aligning a member and brazing filler metal in the air and by non-flux bonding them. CONSTITUTION:A semiconductor integrated circuit 1 is bonded by the use of Pb5Sn solder 9 to a metallization pad 8 formed by baking tungsten and molybdenum in the making process of a ceramic substrate 3 and then by successively plating the substrate with Ni, Au. That is, both Pb5Sn solder 9 and metallization pad 8 are subjected to sputter cleaning by Ar atom 7 for the purpose of removing an oxidation zone and organic pollution layer. Then, after an alignment in the air shown in Figure 4(b), heat fusion is conducted in H2/N2 (H2:N2=1:3) furnace and bonding is made to obtain a non-flux and satisfactory bonded part. Thus, it is possible to contrive to make an apparatus pollution-free and to improve its reliability by an easy work and simple equipment. |
