| 摘要 |
PURPOSE:To reduce the thickness and weight of a package and obtain the flatness of a lead part and facilitate outer lead bonding by a method wherein the package is formed by single-sided resin molding. CONSTITUTION:A copper foil bonded to an insulator 1 composed of a polyimide tape is patterned to form a die-pad 7, inner leads 5 and outer leads 6 and a flexible board is composed. The Al pads of a semiconductor chip 2 bonded to me die-pad 7 with Ag paste are connected to the inner leads 5 with Au wires 4. A resin-molded package 3 is provided only on the surface on which the semiconductor chip 2 is mounted. Windows are formed in the insulator 1 around the package 3 and the copper foil is depressed into the windows to draw out electrodes from the lower surface of the flexible board. With this constitution, the thickness of the package can be reduced while a wire loop height and the thickness of the chip are maintained as it is and, further, the leads are flat and outer lead bonding is easy to perform. |
