| 摘要 |
PURPOSE:To realize highly economical repair wherein bonding process is facilitated, by a method wherein a defective semiconductor chip is not eliminated, and thereon a perfect semiconductor chip is die bonded and superposed. CONSTITUTION:All wires 13 except earth wires 14 connecting electrodes of a defective semiconductor chip 10A and the pattern of a circuit board 1 are eliminated. Conductive adhesive agent 5 is spread on the upper surface of the chip 10A, and a good semiconductor chip 100 is die bonded and superposed on the chip 10A. After that, electrodes of the chip 100 and a signal pattern 3 of the board 1 are connected by wire bonding using other signal wire 130; an earth electrode of the chip 100 and an earth pattern 4 of the board 1 are connected by wire bonding using other earth wire 140. Thus the circuit board and other good semiconductor chip can be used as they are, and bonding process is facilitated, thereby realizing highly economical repair. |
