| 摘要 |
<p>PURPOSE: To enable performing highly reliable thermocompression bonding by providing periodic ridges on the surface of the deformable layer of metals such as gold, palladium, platinum, silver, irridium and nickel. CONSTITUTION: The edge of a bump on a lead or conductor 1 is formed by performing laser fusion of the tip of the conductor 1. Then, two layers of deformable metal are formed thereon. At first, the thin shielding layer of noble metal or non-oxide metal such as gold, silver, palladium, platinum or nickel is attached. A soft, homogeneous and deformable layer 3, having a rough surface pattern such as pure gold, is deposited to the shielding layer. The interval from the peak to the peak of the surface ridges 4 is about 1μm, providing periodicity. Furthermore, the depth between the ridges 4 is about 1/4 to 1/2 of the thickness of an integrated circuit pad to be bonded. The contact material is thermally compressed and bonded in contact with a pad 7 on a chip 6.</p> |
