摘要 |
This invention provides a connector assembly for forming electrical connections to at least two circuit boards disposed in a parallel surface-to-surface relationship. The assembly comprises at least two modules, each of which comprises connector elements. A first set of connector elements provides connections between the circuit board and another electrical device, and a second set of connector elements provides connections between the circuit boards. A heat sink may be provided between the circuit boards. Electronic components on the circuit boards may be sealed by means of a gel, which can also serve to transmit heat from the components.
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