| 摘要 |
A low-cost SAW device package comprises a ceramic or glass carrier chip, a SAW device substrate mounted on the carrier chip via a conventional adhesive and a package cover mounted over the SAW device by a glass frit. The glass frit provides a tight vacuum seal for the SAW device so that outside contamination is prevented. The package cover is fabricated of a low-cost nonmetallic, non-single crystalline material (i.e. glass) having thermal characteristics similar to or the same as those of the SAW device substrate. The packaged SAW device is mounted into a circuit or subsystem using conventional bonding techniques.
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