发明名称 |
Metal bump for a thermal compression bond and method for making same |
摘要 |
A method for making a structure for bonding to a conductive pad on a semiconductor substrate is described. The structure comprises a glassy passivating layer with a thickness of at least 3 microns deposited over the conductive pad. The passivating layer defines an aperture which exposes a portion of the conductive pad. A metal bump covers the portion of the conductive pad exposed in the aperture and further extends over the edges of the glassy passivating layers so as to form a seal between the conductive pad and the glassy passivating layer. A subsequent thermal compression bonding operation on such structure does not cause fractures in the glassy passivating layer due to its thickness. |
申请公布号 |
US5059553(A) |
申请公布日期 |
1991.10.22 |
申请号 |
US19910640658 |
申请日期 |
1991.01.14 |
申请人 |
IBM CORPORATION |
发明人 |
BERNDLMAIER, ERICH;DAS, GOBINDA;VIAU, THOMAS L. |
分类号 |
H01L21/60;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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