| 摘要 |
<p>PURPOSE:To eliminate adverse influence of bubbles generated from a semiconductor element on the upstream side on a semiconductor element on the downstream side in the case of dipping and cooling by disposing a substrate on a slope of a predetermined angle and providing a bypass for escaping the bubbles of the element in a cooling block. CONSTITUTION:A substrate 2 is mounted obliquely at a predetermined angle on a cooling block 1. This angle is provided according to a flowing speed when refrigerant is circulated in a cooling chamber 4. The substrate 2 is mounted on the block 1 to form the chamber 4, and a semiconductor element 3 is disposed in the chamber 4. On the other hand, a series of routes formed of a bypass 11 and a submanifold 5 parallel to the outer surface of the block from the upper surface of the element 3 to a refrigerant return passage 8 is formed on the block 1. This escapes generated bubbles 6 to the passage 8 by cooling the element 3.</p> |
