| 摘要 |
The disclosure concerns a metallic tape that has been previously cut out and is designed for the mounting of surface-mounted components (SMC), using chips having two metallizations on two opposite faces. Each component position, demarcated by two transversal slots, comprises two external connections, each extended by a contact element. This contact element is characterized by a curved shape, formed by a surface to be soldered and a tongue so that, after folding, to create a space for the component, the surfaces to be soldered overlap partially, forming a clip for the component. The disclosure is applicable to the fabrication of SMC components. |
