| 摘要 |
PURPOSE:To complete bonding in spots on a semiconductor chip by one operation and to reduce a time required therefor by using a wire sheet instead of a wire. CONSTITUTION:Au-metallo-organic is printed in a necessary shape for bonding on a leaf of Ni or the like and baked for 5 to 15 minutes at a temperature of about 500 to 850 deg.C in the atmosphere. A wire sheet is prepared by sticking films together so that the surface having Au formed is covered therewith and by dissolving the Ni leaf to be removed by chemical. This wire sheet is aligned with spots of bonding of all electrodes on a semiconductor chip on a base, such as a lead frame, having the semiconductor chip fixed thereon with electrodes on the base, and bonded by one operation. |
