Semiconductor element cooling package,申请号JP19900032144-传众专利搜索

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发明名称	Semiconductor element cooling package
摘要
申请公布号	JPH03235358(K1)	申请公布日期	1991.10.21
申请号	JP19900032144	申请日期	1990.02.13
申请人	TOKYO SHIBAURA ELECTRIC CO	发明人	SHIMADA OSAMU
分类号	H01L23/42	主分类号	H01L23/42
代理机构		代理人
主权项
地址

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