| 摘要 |
<p>PURPOSE:To simplify and automate steps and to improve the mechanical strength of an IC card itself by integrally molding a sheath package of the card by using conductive sealing resin. CONSTITUTION:An entire circuit board 1 is sealed with conductive sealing resin 7 to form a sheath package of an IC card. Since the card is integrally molded with the resin 7, the entire package of the card is held at the same potential. Accordingly, a data damage due to electrostatic breakdown of a semiconductor element 2 on the board 1 in the card can be prevented. As a sealing material, a mixture of conductor filler with insulating plastic may be employed in addition to the conductive resin.</p> |
