| 摘要 |
<p>PURPOSE:To enable improvement in the dimensional accuracy of electrode extraction leads by suppressing warps of semiconductor devices by cooling the surface of electrode extraction leads with an electric insulation material and by surfacing a sheet of electric insulation material on the opposite side with a warp-proof material. CONSTITUTION:The surface of an electric insulative sheet 1 is pierced by an opening 1a and fitted with electrode extraction leads 2: electrodes 8 of a semiconductor chip 3 are connected to these leads 2, and the semiconductor chip 3 is sealed with a sealant 7. The surfaces of electrode leads 2 are coated with solder resist 5 inside the electric insulative sheet 1, and the opposite side is backed with a warp-proof material 6. This warp-proof material 6 is made up of a material having an insulation equal to that of a copper-foil adhesive or solder resist 5.</p> |
