| 摘要 |
<p>Solder wave nozzle adjustment devices allow backplate adjustment, weir height adjustment and gate opening to be adjusted. The device makes adjustments remotely without having to turn off the solder wave thus allowing one to provide the required solder wave parameters. In a solder wave nozzle where liquid solder is pumped upwards from a solder reservoir to form a solder wave, and falls back into the reservoir on at least one side of the nozzle, the improvement comprises a gate, weir or backplate adjustable for height to vary the configuration of the solder wave or the solder flow from the solder wave returning to the solder reservoir, the gate, weir or backplate is positioned on at least one side of the nozzle, and the adjustment is made by remote control operating mechanisms for adjusting the height while solder is pumped upwards to form the solder wave.</p> |
