发明名称 CURABLE RESIN COMPOSITION
摘要 <p>A curable resin composition which is lowly viscous and easy to handle before curing and is excellent in tensile characteristics and also resistant to chemicals and water after curing. The composition comprises an oxypropylene polymer which has at least one group containing a silicon atom having a hydroxyl or hydrolyzable group bonded thereto, a Mw/Mn of 1.6 or less, and a number-average molecular weight of 6,000 or above, and an epoxy resin.</p>
申请公布号 WO1991015533(P1) 申请公布日期 1991.10.17
申请号 JP1991000446 申请日期 1991.04.03
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