| 发明名称 |
Thermosetting resin composition. |
| 摘要 |
<p>Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like. The diamine is of formula <CHEM> The maleimide is the bismaleimide <CHEM> or the polymaleimide <CHEM> </p> |
| 申请公布号 |
EP0451405(A1) |
申请公布日期 |
1991.10.16 |
| 申请号 |
EP19900311676 |
申请日期 |
1990.10.24 |
| 申请人 |
MITSUI TOATSU CHEMICALS, INC. |
发明人 |
YAMAYA, NORIMASA;OHTA, MASAHIRO;YAMAGUCHI, AKIHIRO |
| 分类号 |
C08G73/12 |
主分类号 |
C08G73/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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