| 摘要 |
<p>PURPOSE:To obtain a ceramic laminated plate material for mounting use that no crack is generated in ceramic plates and even if a crack is grown, it does not develop to a large break and a reduction in insulation properties by a method wherein conductors are respectively born on both surfaces of the laminated plate material obtainable by laminating a pair of the electrically insulative ceramic plates and an electrically insulative and thin heat-resistant resin layer pinched between both ceramic plates. CONSTITUTION:A laminated sheet material consists of a pair of ceramic plates 1 and a resin layer 2 pinched between the plates 1, conductors 3 and 4 which are copper sheets are respectively born on both surfaces of the material, the upper side conductor 3 is formed into a pattern suitable for a mounting of chips and the lower side conductor 4 is formed into a pattern to cover almost the material. Accordingly, a chip 11 for transistor use and chips 12 for diode use can be immediately mounted on the copper sheet for conductor 3 use by a means, such as soldering or the like. In case the conductor 4 is mounted on a case 20, it is mounted by a means, such as bond or the like, after the chips are mounted and in case the conductor 4 is mounted on a heat sink, it can be mounted simultaneously with the mounting of the chips.</p> |
