SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To reduce a whole packaging area by mounting an article electrically connected to a semiconductor circuit device on the surface or the interior of a single package in which at least one semiconductor circuit device is encapsulated. CONSTITUTION:A semiconductor integrated circuit 30 is connected to a plurality of bonding wires 40 and is provided in a package 10, and photovoltaic cell 50 is fixed onto a principal surface of the package 10 in the state where it is exposed to the outside, using a desired adhesive and is connected to a power supply terminal 20a for supplying operation power to the semiconductor integrated circuit device 30 among a plurality of external connection terminals 20 through a printed wiring structure 60. The operation power of the semiconductor integrated circuit device 30 is supplied with power generated in the photovoltaic cell 50 by irradiating the photovoltaic cell 50 with external light 70. Thus, a package area is sharply reduced, compared with a case where the semiconductor integrated circuit device 30 and the photovoltaic cell 50 are mounted separately on desired packaging board.