| 摘要 |
PURPOSE:To contrive to improve the reliability of a substrate by reducing various stresses on the substrate through removing beforehand only the part in a wire contacting with a joining pad. CONSTITUTION:A wire 1 is irradiated with CO2 laser beforehand to expose the core wire 1b only in a part contacting with a joining pad. After such processing is conducted, the wire is aligned with the joining pad 4 and a bonding head 3 is brought into contact with the wire 1 from above the wire. A recess 3a corresponding to the shape of the wire 1 is formed at the wire side end of this bonding head 3. On the other hand, the bonding head 3 is always supplied with a constant voltage. The heated bonding head 3 is brought into contact with the wire 1 and joining pad 4 to weld a solder plating 6. The surface tension of the solder plating 6 makes a force for biasing the wire to the joining pad 4 unnecessary so that the wire 1 is joined to the joining pad 4 by a low biasing force. |
