High density interconnect structure with top mounted components.

摘要

The functionality, versatility and connection and packing density of a high density interconnect structure (210) is enhanced by mounting one or more components (222,250) on top of the structure for connection to conductors of the high density interconnect structure and to chips (220) embedded within the structure. Both active and passive components may be mounted in this manner, as may components which would be adversely affected by high density interconnect structure fabrication temperatures or by the presence of the high density interconnect structure dielectric thereon.