| 摘要 |
PURPOSE:To prevent reflow cracks of a tabless package for enhancement of reliability and to package as large a semiconductor chip as possible in a limited space by coating a tab and a tab hanger with precious metal film on their sides in contact with the insulating member 2 and/or on the opposite sides. CONSTITUTION:A resin-sealed semiconductor device includes a semiconductor chip 1, leads 3 connected electrically to the chip, a tab 6 for supporting the chip in a place distant from the leads 3, tab hanger 7 extending from the tab 6, and a resin mold 5 enclosing the above members. On the bottom of the chip 1, there is provided an insulating member 2 on which are arranged the tab 6, the tab hanger 7, and the lead 3. The tab and the tab hanger are coated with precious metal film 9 on their sides in contact with the insulating member 2 and/or on the opposite sides. The leads 3 are coated with precious metal film 9 only on their areas to be electrically connected with the chip. The precious metal film 9 may be silver plating that is weak in adhesion to the resin 5.
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