| 摘要 |
PURPOSE:To provide a reliable hybrid IC having its chip and wires sealed with a sufficiently thick protective resin layer by making a frame-shaped opening in a protective film applied over a substrate around the chip, and forming a frame-shaped resin-bottomed dam member of sufficient height in the opening. CONSTITUTION:A circuit board 1 of a hybrid IC includes a circuit pattern 3 on an insulating material 2, and a protective film 4 on the circuit pattern except the areas for external connection. A semiconductor chip 5 is bonded to a predetermined region on the wiring pattern 3, which is connected with electrode pads on the chip 5 through wires 6. The protective film 4 has a frame- shaped opening 7 near the chip and wires, and a framed-shaped dam layer 8 is provided with its bottom seated in the opening 7. A protective resin layer 9 is provided over the chip 5 and the wires 6 on the area of the board 1 surrounded by the dam layer 8. The protective film 4 can be solder resist.
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