| 摘要 |
The invention relates to a process for fixing the electronic module (14) onto the body (10) of an electronic memory card. The process consists in dipping into a receptacle (40) containing an adhesive substance (42), a dabbing tool (44) comprising several points (50). The drops of adhesive substance (42) which are formed at the extremities of the points (50) are transferred onto the body (10) of the card by applying the tool (44) onto the latter. <IMAGE> |
