发明名称 |
Adhesive for electroless plating, printed circuit boards and method of producing the same |
摘要 |
An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.
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申请公布号 |
US5055321(A) |
申请公布日期 |
1991.10.08 |
申请号 |
US19890344968 |
申请日期 |
1989.04.28 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ENOMOTO, RYO;ASAI, MOTOO |
分类号 |
C23C18/20;H05K1/03;H05K3/00;H05K3/18;H05K3/42;H05K3/46 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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