| 摘要 |
PURPOSE:To make it possible to determine the position of a bottom-pin type electronic component in a short time by monitoring the conducting state of a substrate and the electronic component to be mounted under the state wherein solder bumps are fused, and adjusting the mounting position based on the result. CONSTITUTION:A solder bump 7 is formed on each electrode pad 6 on the surface of a substrate 2. When a bottom-pin type electronic component 1 is mounted on the substrate 2, the conducting state of the substrate 2 and the electronic component 1 to be mounted is monitored. The mounting position is adjusted based on the result. Namely, the junction between the pin 5 and the solder bump 7 is checked by electric conduction. The junction is confirmed based on the conductivity of the conduction. Thus, the bottom-pin type electronic component 1 can be positioned in a short time highly accurately. |
