Solder resist composition

摘要

A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.