RESIN COMPOSITION FOR ELECTRONIC PART SEALING USE AND SEALED ELECTRONIC PART THEREFROM

摘要

PURPOSE:To obtain the title composition excellent in moisture resistance, causing no silicone oil bleeding out by incorporating a polyarylene sulfide with an inorganic filler and an epoxy-modified silicone oil having a specified epoxy equivalent. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100 pts.wt. of a thermoplastic resin blend composed of A1: 25-60wt.% of a polyarylene sulfide >=250 deg.C in melting point and 10-500 poise in melt viscosity, consisting mainly of recurring unit of the formula and A2: 40-75wt.% of an inorganic filler (e.g. silica-alumina) with (B) 1.5-5 pts.wt. of an epoxy-modified silicone oil 350-1000g/eq. in epoxy equivalent.