| 摘要 |
PURPOSE:To obtain a (copper-clad) laminated board, excellent in heat resistance and good in operating efficiency in producing printed wiring boards by impregnating a nonwoven fabric with a cresol novolak type epoxy resin-containing flexible thermosetting resin, drying the impregnated nonwoven fabric, using and hot-press forming the resultant prepreg. CONSTITUTION:A nonwoven fabric of glass fiber mixed with polyester fiber (preferably at 30-70% mixing ratio of polyester fiber) is impregnated with a flexible thermosetting resin containing 5-15% cresol novolak type epoxy resin and the resultant impregnated nonwoven fabric is then dried to provide a prepreg, which is subsequently used and hot-press formed to afford the objective (copper-clad) laminated board. |
