| 摘要 |
A method of bonding an electrical conductor (22,23) to a contact (25) of an integrated circuit (IC) device comprises bonding the conductor (22,23) to a support member (20) and to a contact (25) of the IC device. The conductor (22,23) is then severed to release the IC device and conductor (22,23) from the support (20). This allows the IC device to be tested while connected to the support member (20) and provides it with a conductor lead (22,23) for connection to a carrier for use. |
