| 摘要 |
PURPOSE:To move a laser chip to a prescribed position so as to enable the light emitting point of a laser to be uniquely fixed to a sub-mount by a method wherein a laser chip is pressure-joined to a sub-mount protrudent part and held for a some time at a temperature higher than the melting point of solder. CONSTITUTION:A laser chip 3 is die-bonded to a sub-mount 1 by a method that the laser chip 3 whose assembly surface is coated with a metallized layer 2, a sub-mount 1 is coated with a metallized layer 2, the chip 3 and the sub- mount 1 are made to stand for a some time at a temperature higher than the fusing point of solder, and then the sub-mount 1 and chip 3 are cooled. Then, when a voltage is applied between the upper part of the laser chip 3 and the lower part of the sub-mount 1 to enable a current larger than a laser oscillation threshold current flows between them, a laser beam is emitted from a light emitting point 4. By this setup, the surface tension of solder acts on a laser chip to move it so as to uniquely fix the light emitting point of the laser chip to a sub-mount.
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