| 摘要 |
PURPOSE:To prevent peeling of a bonding pad by depositing an insulating film having excellent adhesive properties to both a smooth coating film and a Ti film between the coating film and the Ti film. CONSTITUTION:An Si substrate 1, a silicon oxide film 2 formed by oxidizing the substrate at a high temperature, a smooth coating film 3 deposited by a CVD method, Ti barrier metal 4, an aluminum film 5, and a passivation film 6 made of SiO or SiO2 opened on the film 5 are provided. Further, an insulating oxide film 7 having high contact tight strength to be deposited by a CVD method under reduced pressure at a high temperature is provided on the film 3, and the metal 4 and the others are formed on the film 7. Thus, peeling of the pad can be prevented without altering the characteristics of Ti barrier metal. |
