| 摘要 |
This invention provides a curable resin composition which has a low viscosity, hence is easy to handle, before curing and, after curing, gives cured products having good tensile characteristics and, in addition good chemical resistance and water resistance. This composition comprises (A) an oxypropylene polymer having at least one silicon atom-containing group with a hydroxyl group or a hydrolyzable group being bound to the silicon atom and having an Mw/Mn ratio of not more than 1.6 and a number average molecular weight of not less than 6,000, and (B) an epoxy resin. This invention provides a curable resin composition which has a low viscosity, hence is easy to handle, before curing and, after curing, gives cured products having good tensile characteristics and, in addition good chemical resistance and water resistance. This composition comprises (A) an oxypropylene polymer having at least one silicon atom-containing group with a hydroxyl group or a hydrolyzable group being bound to the silicon atom and having an Mw/Mn ratio of not more than 1.6 and a number average molecular weight of not less than 6,000, and (B) an epoxy resin.
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