BOILING TYPE COOLER DEVICE FOR POWER SEMICONDUCTOR SWITCHING ELEMENTS

摘要

A boiling cooler device for cooling thyristers, etc., is made of copper and utilizes water or an aqueous solution of ethylene glycol as the cooling medium. The cooler fins 31 constituting the evaporators of the device are disposed to a side of a common liquid reservoir 33 directly coupled to the condensor 24, to be coummunicated thereto via substantially horizontally extending ducts 32 (Figs. 8 and 9). Each cooler fin 31 may be coupled to the common reservoir 33 via two parallel ducts 34 and 35 (Fig. 10). The cooler fins 31 may each comprise vertically extending interior conduits 42 at the interior side of the heat absorbing surfaces 31a (Figs. 13 through 15). The evaporator 51 amy comprise a first cooling medium conduit 53 and second cooling medium conduits 54 having a smaller overall cross sectional area than the first conduit 53 (Figs. 32 and 33). Metal particles 61, preferably having a particle size of from about 400 to 1000 micormeters, may be attached to the heat transfer surfaces of the cooler fins 31 (Figs. 41 and 42). Further, optimal ranges of a dimensionless number F for stabilizing the cooling efficiency is disclosed for respective cooling media.