发明名称 |
Radio frequency plasma enhanced chemical vapor deposition process and reactor |
摘要 |
An improved capacitively coupled radio frequency-plasma enhanced chemical vapor deposition (PECVD) apparatus and process are disclosed for depositing a uniform coating of material on substrates. The apparatus includes a secondary electrode defining a reaction zone within an outer chamber and an RF electrode in concert with the secondary electrode for generating a plasma within the reaction zone. The electrode comprising a base and a finger extending through the reaction zone for distributing a plasma field uniformly throughout the reaction zone. The process comprises heating a substrate to a deposition temperature in the range of about 300 DEG to 650 DEG C. Reactant gases are introduced into the PECVD reactor and a coating of about 0.2 to about 20 mu m is deposited onto the heated substrate. This low temperature process is particularly adapted to coating three-dimensional objects of metals, metal alloys and mixtures of metals.
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申请公布号 |
US5052339(A) |
申请公布日期 |
1991.10.01 |
申请号 |
US19900598500 |
申请日期 |
1990.10.16 |
申请人 |
AIR PRODUCTS AND CHEMICALS, INC. |
发明人 |
VAKERLIS, GEORGE;HALVERSON, WARD D.;GARG, DIWAKAR;DYER, PAUL N. |
分类号 |
C23C16/44;C23C16/455;C23C16/509;H01J37/32 |
主分类号 |
C23C16/44 |
代理机构 |
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