| 摘要 |
PURPOSE:To shorten the bonding length at the time of connecting power supply pads and power supply stitches for reduction of the production cost by mounting them parallel to each side of an IC chip and on the same layer, insulating them electrically. CONSTITUTION:Power supply stitches 1, 2 are mounted parallel to each side of an IC chip 6. At that time, the power supply stitches 1, 2 are insulated electrically. By mounting the low position power supply stitch 1 and the high position one 2 separately on the same layer, the bonding length can be shortened when connecting power supply pads 4, 5 and the power supply stitches 1, 2 by bonding wires. At the same time, the production cost can also be reduced since the power supply stitches 1, 2 are formed on the same layer. |
