| 摘要 |
Epoxy resin compositions which contain a) at least one epoxy resin containing, on average, more than one 1,2-epoxy group per molecule, b) an anhydride hardener for the epoxy resin a), c) a toughener, and d) a compound containing two active hydrogen atoms which is capable of reacting with the epoxy resin a) have an outstanding toughness and are suitable as casting resins, laminating resins, moulding compounds, coating compounds and encapsulation systems for electric al and electronic components.
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