| 摘要 |
PURPOSE:To enable the manufacturing method of a multilayer printed wiring board which is small in dimensional shrinkage at a bonding process through which it is formed multilayered to be offered by a method wherein a fluid layer is provided between the outermost copper foil or an outer board and a plate die. CONSTITUTION:A fluid layer obtained by sandwiching a resin sheet 6 between films or die foils 5 is provided between an outermost copper foil 3 and a plate die 4. Resin or viscose liquid can be separately used as a fluid layer, or a base material such as a woven fabric or a nonwoven fabric impregnated with resin or viscose liquid can be also used as a fluid layer. Therefore, the fluid layer is hardly affected by the thermal expansion of a plate die at heating, viscose fluid is made to flow toward the end face of a multilayer printed wiring board by pressure, whereby a force is induced to spread a prepreg and an inner board, and the inner board is spread larger in size. The fluid layer spreads the inner board and the prepreg layer, so that the inner boards are supposed to be prevented from shrinkage in dimension in a bonding process in which a multilayer printed wiring board is bonded and multilayered. |
