COOLING STRUCTURE FOR HEAT GENERATING ELECTRONIC COMPONENTS MOUNTED ON A SUBSTRATE

摘要

A cooling structure for cooling heat generating electronic components mounted on a substrate is disclosed. It includes a cold plate fixed on the substrate which is provided with first through holes opposed to the upper surfaces of the heat generating electronic components. Flow paths are formed inside the cold plate for circulating a coolant. An inlet is provided on a side of the cold plate for supplying the coolant to the flow paths. An outlet is provided on a side of the cold plate for exhausting the coolant from the flow paths. Pistons are inserted and held inside the through holes so that the lower surfaces of the pistons come into contact with the upper surfaces of the heat generating electronic components.