发明名称 METHOD AND DEVICE FOR LASER BEAM MACHINING
摘要 PURPOSE:To effectually reduce the time of a piercing process by setting the focus of laser beam to the surface of a material to be machined and making holes in a piercing process and moving the focus of the laser beam in a cutting process after holes are made and cutting the material to be machined. CONSTITUTION:The laser beam 1 generated in a laser beam oscillator is introduced as far as the material 3 to be machined. The surface of the material 3 to be machined is irradiated with the laser beam 1 and cut. The cutting process is composed of a piercing process and a cutting process. The focus F of the laser beam 1 is set to the surface of the material 3 to be machined and the holes are made on the way to the piercing process time or before the piercing process is completed. On the way to the piercing process or after it is completed, the focus F of the laser beam 1 is moved to the focal position of the laser beam 1 in a cutting process and cutting work is executed. In this way, the total hours of the laser beam machining process can be reduced drastically.
申请公布号 JPH03221286(A) 申请公布日期 1991.09.30
申请号 JP19900018569 申请日期 1990.01.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KARASAKI HIDEHIKO;TANAKA AKIO
分类号 B23K26/00;B23K26/04;B23K26/38;H01S3/00 主分类号 B23K26/00
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