| 摘要 |
PURPOSE:To provide the subject prepreg employed for adhering a metal plate to a metal foil therethrough to form a metal substrate having excellent processing reliability, dimensional stability, etc., and employed for preparing a printed wining board by impregnating an aramide fiber non-woven fabric, etc., with an epoxy resin composition and drying the product. CONSTITUTION:100 pts.wt. of an epoxy resin such as bisphenol A diglycidyl ether preferably having a Na ion content of <=10ppm and a hydrolyzable chlorine content of <=600ppm is compounded with 0.01-200 pts.wt. of a curing agent (e.g. 2-ethyl-4-ethylimidazole), a curing accelerating agent, a catalyst, etc., to provide an epoxy resin composition. The epoxy resin composition is adjusted with a solvent (e.g. methyl ethyl ketone) into a solid concentration of 5-80wt.% and subsequently impregnated into an aramide fiber non-woven fabric or aramide fiber paper in an adhered epoxy resin amount of 5-95wt.% based on the whole amount of the prepreg to provide the objective prepreg. |
