Heat-sink structures with increased heat dissipation capacity

摘要

Mfr. of a heat-sink substrate, consisting of crystalline acicular particles i.e. particles in the form of fibres or whiskers of thermally-conductive ceramics, and opt. non-acicular ceramic particles, embedded in a compact matrix of non-porous, dense, thermally-conductive ceramics, comprises a) slurrying the ceramic particles in a solvent contg. a binder and shaping the slurry into a porous mat-like structure of interconnected particles by moulding or casting, followed by drying and, if required, consolidation by firing; and b) filling the voids between the particles with a dense compact phase of thermally conductive ceramics under solid or gas phase conditions.