PROCESS FOR PRODUCING EQUAL, HIGH ADHESIVE, COPPER LAYER OF LESS THAN 0,1 DIAMETER ON POLYAMIDE SUBSTRATE,申请号HU19890000432-传众专利搜索

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发明名称	PROCESS FOR PRODUCING EQUAL, HIGH ADHESIVE, COPPER LAYER OF LESS THAN 0,1 DIAMETER ON POLYAMIDE SUBSTRATE
摘要
申请公布号	HU203797(B)	申请公布日期	1991.09.30
申请号	HU19890000432	申请日期	1989.01.30
申请人	LORANTH,JOZSEF,HU;PINTER,JANOS,HU;NYIRI,LAJOS,HU	发明人	LORANTH,JOZSEF,HU;PINTER,JANOS,HU;NYIRI,LAJOS,HU
分类号	C23C2/02;(IPC1-7):C23C2/02	主分类号	C23C2/02
代理机构		代理人
主权项
地址

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