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发明名称
OUTER LEAD BENDING DEVICE FOR SEMICONDUCTOR PACKAGE
摘要
申请公布号
JPH03219661(A)
申请公布日期
1991.09.27
申请号
JP19900013518
申请日期
1990.01.25
申请人
Y K C:KK
发明人
MATSUMOTO AKIRA
分类号
H01L23/50;B21D43/05;H05K13/02
主分类号
H01L23/50
代理机构
代理人
主权项
地址
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