| 摘要 |
PURPOSE:To enhance sealability and stress resistance and to improve reliability of a chip-on-flexible printed board (COF) by integrating sealing resin with a reinforcing plate in a state for holding a flexible printed board (FPC). CONSTITUTION:Heated fluidized sealing resin is so dropped in a state that a protrusion 6 is passed through a hole 7 as to cover a semiconductor 3. When the resin reaches the protrusion 6 protruding on an FPC 1, the protrusion disturbs the flow of the resin to stop the flow of the resin, and the resin is cured at the point to form a sealed part 8. A reinforcing plate 5 is integrated with the part 8 by selecting the materials of the plate 5 and the resin with excellent sealability, the FPC 1 is formed in a state in which both are held, and the part for connecting the semiconductor 3 to a wiring pattern 2 is so reinforced as not to bend the plate 5. Accordingly, even if a bending stress is operated at the part 8, the resin is not peeled from the FPC to eliminate the stress at the connection part of the semiconductor 3 to the pattern 2. |
