| 摘要 |
<p>PURPOSE:To enable a small-sized semiconductor to be loaded for making a package small-sized having multiple pins by providing a metal plate on the lowermost side of a filmy board through an insulating layer and forming the resin sealing part only on the board upper surface. CONSTITUTION:A filmy multilayer board 12 is formed of a wiring pattern including inner leads 6, outer leads 5 and die pads 7, an insulating layer a4 fixed to the upper part of the inner leads 6 and the outer leads 5, and a metal plate 9 fixed to the die pad 7 and the lower parts of the inner leads 6 and the outer leads 5 through an insulating layer b8. In this case, the resin part 3 formed only on the filmy board 12 and the side of the inner leads 6 of the lower part around the resin sealing part 3 have resin stoppers. Thereby, a semiconductor element 1 can be made small, further cutting of tie bars becomes needless, an outer lead pitch can be further reduced so as to fully cope with small and multi-pin packages.</p> |
