| 摘要 |
<p>PURPOSE:To prevent generation of an outer lead bend by providing the recessed parts for position fixing on the lower parts of the mutually corresponding sides of a resin-sealing part, to which outer leads are projected, while providing projection parts upwardly projecting to an outer shell so as to correspond to these recessed parts. CONSTITUTION:A semiconductor device consists of a semiconductor element 1, outer leads 3 connected thereto by metal fine lines 5, a semiconductor mounting part 4 and a resin-sealing part 6 molding these. The outer leads 3 are respectively projected to both side of the resin sealed part 6, and the lower parts of the mutually corresponding sides of the resin sealing part 6 are provided with the recessed parts 9, which are parallel to the sides while being connected to the base. A packaging device is composed of an outer shell part 7 and the projection parts 8 upwardly projecting from the inner base thereof, and the projection parts 8 maintain fixed clearance along the recessed parts 9 of the semiconductor, while being formed so that it may have the height exceeding the height from the horizontal plane of the recessed parts 9 to the tip lower sides of the outer leads 3. Thereby, no lead bend of the semiconductor device is generated.</p> |
