MULTILAYER PRINTED-WIRING BOARD AND ITS MANUFACTURE

摘要

PURPOSE:To enable a thermal coefficient of expansion of an insulation layer in thickness direction to be kept to a small value and a through-hole conduction reliability to be improved by setting a surface circuit and one surface of an inner-layer circuit to an insulation layer consisting of an aramid fiber non-woven cloth. CONSTITUTION:A resin-dipped glass fiber woven cloth layer 5 or a resin-dipped glass fiber non-woven cloth layer 5 is included between a circuit surface of an outer-layer plate 3 where a circuit 2 is formed on a single surface of a resin-dipped aramid fiber non-woven insulation layer 1 and an inner-layer plate 4 where the circuit 2 is formed on both surfaces of the resin-dipped aramid fiber non-woven cloth insulation layer 1 for forming one piece with heated press formation. The surface circuit is formed after that. In the case of a multilayer printed-wiring board with a four-layer circuit, the resin-included glass fiber woven layer 5 or the resin-included glass fiber non-woven cloth layer 5 is included between the circuit surfaces of two outer-layer plates 3 where the circuit 2 is formed on a single surface of the resin-dipped aramid fiber non-woven insulation layer 1 for forming one piece with heated press formation.